• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    By bonding two IC chips to each other via an anisotropic conductor, each of the protrusions provided at opposite positions is electrically connected to form an IC chip module. According to the IC chip module having such a structure, the communication function is completed only by stacking two IC chips in which the functions of the processor and the antenna are accommodated, and wiring is not performed outside the IC chip. This eliminates the occurrence of disconnection or the like of the wiring and at the same time makes the assembly extremely easy. Therefore, a circuit chip mounting card or the like having high reliability and low manufacturing cost can be provided.
    公开号:KR20000062336A
    申请号:KR1019997005800
    申请日:1997-12-22
    公开日:2000-10-25
    发明作者:이케후지요시히로；치무라시게미；오카다히로하루
    申请人:사토 게니치로；로무 가부시키가이샤；
    IPC主号:
    专利说明:

    CARD MOUNTED WITH CIRCUIT CHIP AND CIRCUIT CHIP MODULE}
    Contactless IC cards are used for lifts on ski slopes, automatic ticket gates and automatic sorting of cargo.
    12 shows an example of a conventional non-contact type IC card.
    The IC card 2 shown in FIG. 12 is a one-coil type IC card and includes a coil 4, a capacitor C1, a C2, and an IC chip 8 used as an antenna.
    The capacitors C1, C2 and the IC chip 8 are mounted on a film-like synthetic resin substrate.
    The substrate on which the capacitors C1, C2 and the IC chip 8 are mounted is called a tap automated bonding (TAB) 10.
    13A is a sectional view of the IC card 2.
    A core member 12 of synthetic resin is sandwiched between a pair of surface layer materials 14 and 16.
    The tab 10 on which the capacitors C1, C2, and the IC chip 8 are mounted is fixed to the surface material 14 exposed in the cavity 18 formed in the core member 12.
    The joint portion of the tab 10 and the IC chip 8 is covered with a sealing material 9 such as an epoxy resin.
    The coil 4 is disposed between the surface material 14 and the core member 12.
    The coil 4 and the tab 10 are connected by a wire 20.
    The circuit diagram of the IC card 2 is shown in FIG. 13B.
    The IC card 2 receives the electromagnetic waves transmitted from the reader / writer (recording / reading apparatus, not shown) to the resonant circuit 22 constituted by the coil 4 and the condenser C1 and uses them as a power source.
    The capacitor C2 is a capacitor for power smoothing.
    Moreover, the control part (not shown) provided in the IC chip 8 decodes and transmits the information superimposed on the electromagnetic wave, and responds.
    The response is performed by changing the impedance of the resonant circuit 22.
    The reader / writer can know the response contents by detecting a change in impedance (impedance reflection) of the resonant circuit (not shown) of the resonant circuit (not shown) accompanying the change in the impedance of the resonant circuit 22 on the IC card 2 side.
    In this way, when the IC card 2 is used, information can be transmitted and received without contacting the power supply.
    However, the conventional IC card as described above has the following problems.
    In the IC card 2, the coil 4 and the tab 10 must be connected by the wires 20.
    On the other hand, the IC card 2 is often put in a purse or a pocket of pants, and may receive a very strong bending force, torsional force or pressure.
    However, the thickness t of the IC 2 shown in Fig. 13A is a standard dimension and is not so thick.
    Therefore, the rigidity against bending, torsion or pressure is not so great.
    Therefore, when the IC card 2 receives a strong bending force or the like, the twist becomes considerably large.
    When such a twist occurs, the wire 20 may be disconnected or the connection between the tab 10 may be released from the wire 20 and the coil 4.
    In addition, a connection failure may occur in the operation | work which connects the wire 20, the coil 4, or the tab 10. FIG.
    In addition, the position at which the tab 10 is installed is limited in order to secure a place for installing the coil.
    For this reason, the tab 10 may be forced to be disposed at a position where a large twist occurs.
    Such deformation causes cracks in the IC chip 8, thereby impairing the function of the IC card.
    Thus, the conventional IC card has a problem that it is difficult to handle and lacks reliability.
    Moreover, since the coil 4 and the tab 10 had to be connected by the wire 20, assembly was troublesome and the manufacturing cost was raised.
    In addition, the capacitors C1, C2, and the like must be mounted on the tab 10, further increasing the manufacturing cost.
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card and circuit chip module having a circuit chip mounted thereon, and more particularly, to a circuit chip mounting card and a circuit chip module which realizes improved reliability, reduced manufacturing cost, and the like. .
    1 is a view showing the external configuration of a non-contact type IC card 70 in one embodiment of the present invention;
    2 is a cross-sectional view showing a cross section taken along the line II-II in FIG. 1;
    3A is a front view of the IC chip module 74, FIG. 3B is a view showing each element of the IC chip module 74 before coupling;
    4 is a conceptual view of the IC chip 76 shown in FIG. 3B viewed from above (protrusion 82 side);
    FIG. 5 is a conceptual view of the IC chip 78 shown in FIG. 3B viewed from below (protrusion F4 side);
    6 is a diagram for explaining bypass wiring and a dummy bump;
    Fig. 7 is a diagram showing a cross-sectional structure of a non-contact type IC card 30 in another embodiment of the present invention.
    8 is a diagram showing a cross-sectional structure of a non-contact type IC card 50 according to still another embodiment of the present invention.
    Fig. 9 is a diagram showing a cross-sectional structure of a non-contact type IC card 17 according to still another embodiment of the present invention.
    Fig. 10 is a diagram showing a resonant circuit 50 of an IC chip module in still another embodiment of the present invention.
    FIG. 11 is a diagram showing a resonant circuit 160 of an IC chip module according to still another embodiment of the present invention;
    12 is a view showing an example of a conventional non-contact type IC card;
    13A is a cross-sectional view illustrating a cross section taken along a line XIIIA-XIIIA in FIG. 12;
    13B is a circuit diagram of the IC card 2,
    (Explanation of symbols for the main parts of the drawing)
    32,36. Surface material, 34. Core member
    44. Coil, 70. IC card
    72. cavity, 74. IC chip module
    76,78. IC chip, 80. Anisotropic conductor
    82,84. Projections, 86a to 86e. spin
    88a to 88c. Protuberance, C1, C2. Condenser
    SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit chip mounted card or the like having high reliability and low manufacturing cost while solving the above-mentioned conventional problems.
    The circuit chip mounting card of the present invention which achieves the above-mentioned object is, in one aspect, a card having an antenna that communicates using electromagnetic waves and a processor that performs a process related to communication, and includes at least a portion of the processor. And a first circuit chip having a terminal, and a second circuit chip having a terminal, including a remaining portion of the antenna and a processing unit, and stacking the first circuit chip and the second circuit chip in the thickness direction of the card. It is characterized in that it is comprised so that the terminal may mutually electrically connect.
    According to the present invention having such a configuration, the communication function is completed only by stacking two circuit chips in which the functions of the processor and the antenna are accommodated, so that wiring is not required outside the circuit chip.
    Therefore, the connection defect accompanying the external wiring connection work does not arise.
    Also, even if the card is repeatedly warped, an accident such as disconnection or disconnection of the external wiring cannot occur.
    In addition, since the antenna is accommodated in the second circuit chip and overlaps with the first circuit chip, the position where the circuit chip is to be installed is not limited in order to secure a place where the antenna is to be installed.
    Therefore, the circuit chip of the small area which overlapped in arbitrary position which does not produce big curvature can be arrange | positioned.
    For this reason, even if a large force is applied to the card, the circuit chip does not deform significantly.
    In addition, since there is no connection work for external wiring, assembly is extremely easy.
    Therefore, manufacturing cost can be reduced.
    In addition, since the capacitor is also incorporated in the circuit chip, the trouble of mounting the capacitor is unnecessary.
    Therefore, manufacturing cost can be further reduced.
    That is, a circuit chip mounted card with high reliability and low manufacturing cost can be realized.
    In the circuit chip mounting card of the present invention having the above-described configuration, the terminal is preferably provided on the second circuit chip side of the first circuit chip, and the first circuit chip side of the second circuit chip is provided. The terminals are provided opposite to the terminals provided on the circuit chips of the circuit chip, and are joined by directly stacking the first circuit chip and the second circuit chip.
    By having such a structure, the two circuit chips can be easily combined and modularized using the conventional technique of coupling between terminals.
    Therefore, the manufacturing cost can be reduced further by the improvement of workability at the time of manufacture.
    In another aspect, the circuit chip mounting card of the present invention is a card having an antenna that communicates using electromagnetic waves and a processing unit that performs a process related to communication, and the first substrate is based on the first substrate. And a second substrate disposed at a predetermined distance apart in the thickness direction of the card, a core member layer disposed between the first substrate and the second substrate, and a circuit chip module disposed in the core member layer. A terminal provided with the circuit chip module including at least a part of the processing section and having a terminal, the antenna chip and the remaining portion of the processing section, and provided opposite the terminals of the first circuit chip; The second circuit chip is laminated and bonded in the thickness direction of the card via an anisotropic conductor, so that the terminals are electrically connected to each other to form an assembly.
    By having such a structure, according to this invention, two circuit chips can be firmly joined by laminating | stacking through an anisotropic conductor.
    Moreover, it is common for the circuit chip before assembling to the card to be provided with an opening for reaching the wiring layer such as aluminum via the protective film on the surface for external wiring or the like.
    Therefore, there is a concern that the aluminum layer of the wiring layer may corrode after the circuit chip is manufactured and assembled to the card, and by aging change after assembly.
    However, in the circuit chip mounting card according to the present invention, since external wiring is not necessary when assembling to the card, after the manufacture of the first circuit chip and the second circuit chip, both circuit chips are made through an anisotropic conductor. Can be combined
    That is, corrosion of aluminum and the like in the wiring layer can be reduced by bringing the first circuit chip and the second circuit chip into close contact with each other through the anisotropic conductor.
    In a preferred embodiment of the circuit chip mounting card of the present invention, a reinforcement having a frame body arranged to surround the first circuit chip and the second circuit chip in the plane direction of the card is provided in the card.
    By having such a structure, the rigidity of the card in the vicinity of a circuit chip can be raised effectively, ensuring the space which accommodates a laminated circuit chip.
    For this reason, even if a strong torsional force, pressure, or the like is applied to the card, the stacked circuit chips do not greatly deform.
    That is, the reliability of the circuit chip mounting card can be further improved.
    In one aspect, the circuit chip module of the present invention is a circuit chip module constituting a card having a circuit including an antenna for communicating by using electromagnetic waves and a processing section for performing communication-related processing. A first circuit chip having a terminal and having a terminal, and a second circuit chip having a terminal at the same time including a remainder of the antenna and the processing unit, and including the first circuit chip and the second circuit chip of the card. It is characterized by being configured so as to electrically connect the terminals between each other by laminating in the thickness direction.
    With such a configuration, according to the circuit chip module of the present invention, only one small circuit chip module can perform a communication function.
    For this reason, the degree of freedom in placement in the card is high.
    In the assembling work, only one module that has been molded in advance needs to be handled, thereby further reducing the manufacturing cost by improving workability.
    In a preferred embodiment of the circuit chip module of the present invention, the resonant frequency of the resonant circuit constituted by the capacitor and the coil of the antenna provided inside the circuit chip is adjustable.
    According to such a structure, after forming a capacitor | condenser and a coil in a circuit chip, the capacitance or inductance of a resonant circuit can be adjusted.
    Therefore, although all the circuit elements constituting the resonant circuit are formed in the circuit chip, the resonance frequency can be adjusted after the formation of these circuit elements.
    In other words, even if there are variations in manufacturing conditions, the resonance frequency can be made constant to some extent, so that the reliability of the circuit chip mounted card is high.
    Moreover, in the manufacturing process of a circuit chip, since the circuit chip corresponding to various resonance frequencies can be obtained without changing the mask pattern which forms a circuit element, manufacturing cost can be held down.
    The circuit chip module of this invention is a circuit chip assembly which laminated | stacked the 1st circuit chip and the 2nd circuit chip in another form, Comprising: At least one circuit chip of a 1st circuit chip and a 2nd circuit chip. A bypass wiring for electrically connecting two terminals of one of the circuit chips to each other, and between the two terminals of the other circuit chip respectively connected to the two terminals so as to be electrically connected through the bypass wiring. It is characterized by the configuration.
    By having such a configuration, according to the circuit chip module of the present invention, it is possible to combine two circuit chips to perform the original function for the first time.
    Therefore, even if the circuit chip module is decomposed into two circuit chips, it is difficult to analyze the function from each terminal.
    In addition, by providing a plurality of bypass wirings, analysis of the function becomes further difficult.
    That is, a circuit chip module with a high secret protection effect can be realized.
    Fig. 1 shows an external configuration of a non-contact type IC card 70 as a circuit chip mounting card in one embodiment of the present invention.
    The IC card 70 is a single-coil IC card and can be used for lifts on ski resorts, automatic ticket gates of railways, and automatic sorting of cargo.
    2 is a cross-sectional view taken along the line II-II in FIG. 1.
    The IC card 70 has a structure in which the surface layer material 32 serving as the first substrate, the core member 34 forming the core member layer, and the surface layer material 36 serving as the second substrate are laminated in this order.
    As the surface materials 32 and 36, synthetic resins such as vinyl chloride and PET (polyethylene terephthalate) are used.
    The core member 34 is made of synthetic resin.
    A cavity 72 is formed in the layer formed of the core member 34.
    An IC chip module 74 as a circuit chip module is fixed to the cavity 72 in contact with the surface layer material 32.
    A front view of the IC chip module 74 is shown in FIG. 3A.
    The IC chip module 74 passes through the anisotropic conductor 80 through the IC chip 76 as the first circuit chip and the IC chip 78 as the second circuit chip (Fig. 2). It is a bonded body laminated | stacked and bonded together.
    3B shows each element of the IC chip module 74 before coupling.
    The IC chip 76 is provided with the some processus | protrusion 82 which is a terminal in the upper part.
    The IC chip 78 is provided with the some processus | protrusion 84 which is a terminal in the lower part.
    Each protrusion 82 and the protrusion 84 are provided in the mutually opposing position.
    The anisotropic conductor 80 is an electrically conductive conductor in only one direction and has adhesiveness.
    As the anisotropic conductor, for example, anisolum (Hitachi Co., Ltd.), which is a thermosetting adhesive, can be used.
    By using such an anisotropic conductor 80, the IC chip 76 and the IC chip 78 can be firmly bonded.
    By attaching the IC chip 76 and the IC chip 78 using the anisotropic conductor 80, the projection 82 and the projection 84 provided at mutually opposite positions are electrically connected.
    In this way, the IC chip module 74 can be formed.
    4 is a conceptual view of the IC chip 76 viewed from above (protrusion 82 side).
    The IC chip 76 is provided with a nonvolatile memory (not shown), a modulation / demodulation circuit (not shown), and the like which are part of the processing unit.
    5 is a conceptual view of the IC chip 78 viewed from below (protrusion 84 side).
    The IC chip 78 is provided with a coil 44, which is an antenna, and capacitors C1, C2, etc., which are the remainder of the processing section.
    The coil 44 is formed by forming a metal wiring layer in a loop shape.
    At least one of the capacitors C1 and C2 is made of ferroelectric.
    In addition, the resonant circuit is formed by the coil 44 and the capacitor C1.
    The capacitor C2 is a capacitor for power supply smoothing.
    In this configuration, since the communication function is completed only by stacking two IC chips 76 and 78 in which the functions of the processing unit and the antenna are accommodated, wiring can be performed outside the IC chips 76 and 78. no need.
    For this reason, the connection defect accompanying the external wiring connection work does not arise.
    In addition, even if the deflection is repeatedly applied to the IC card 70, the accident that the external wiring is disconnected or the connection is released does not occur.
    Moreover, since the coil 44 is accommodated in the IC chip 78 and overlaps with the IC chip 76, the position in which the IC chip is installed is not limited to secure the place where the coil is installed.
    Therefore, the IC chips 76 and 78 of the overlapping small area can be arrange | positioned in the arbitrary position which a big curvature does not generate | occur | produce.
    Therefore, even if a large force is applied to the IC card 70, the overlapped IC chips 76 and 78 are not greatly deformed.
    In addition, since there is no connection work for external wiring, assembly is extremely easy.
    Therefore, manufacturing cost can be reduced.
    In addition, since the capacitors C1 and C2 are also incorporated in the chip 78, the trouble of mounting these capacitors C1 and C2 becomes unnecessary.
    Therefore, manufacturing cost can be reduced further.
    In addition, only one small IC chip module 74 can perform a communication function.
    Therefore, the degree of freedom of arrangement in the IC card 70 is high.
    In the assembling work, only one IC chip module 74 formed in advance needs to be handled, thereby further reducing the manufacturing cost by improving workability.
    Next, the bypass wiring, dummy protrusion, and dummy wiring used for the IC chip module 74 will be described.
    6 is a diagram for explaining a dummy protrusion and a bypass wiring.
    The IC chips 76 and 78 are provided with the projections 86a to 86e and 88a to 88c shown in FIG. 6 in addition to the projections 82 and 84 shown in FIGS. 4 and 5. .
    In addition, wirings 90a, 90b, and 92 are provided.
    The wiring shown in FIG. 6 is a bypass wiring.
    In addition, the projections 86e and 88c are dummy projections.
    The projections 86a and 86b provided on the IC chip 76 are connected by a wiring 90a provided on the IC chip 76.
    The projection 86c and the projection 86d are connected by a wiring 90b provided inside the IC chip 76.
    On the other hand, the projections 88a and 88b formed on the IC chip 78 are connected by a wiring 92 provided inside the IC chip 78.
    In addition, the projection 86b formed on the IC chip 76 and the projection 88a formed on the IC chip 78 are formed at positions facing each other.
    In the same way, the projections 86c formed on the IC chip 76 and the projections 88b formed on the IC chip 78 are formed at positions facing each other.
    Therefore, when the IC chip 76 and the IC chip 78 are coupled via the anisotropic conductor 80 (see FIG. 3B), the projection 86a formed on the IC chip 76 is connected to the wiring 90a and the projection 86b. ), The projection 88a, the wiring 92, the projection 88b, the projection 86c, and the wiring 90b are connected to the projection 86d.
    In such a configuration, the original functions of the IC card 70 cannot be exhibited unless two IC chips of the IC chips 76 and 78 are combined.
    Therefore, even if the IC chip module 74 is to be broken down into two IC chips, it is difficult to analyze the function from each terminal.
    Further, the projections 86e formed on the IC chip 76 and the projections 88c formed on the IC chip 78 are formed at mutually opposite positions, but similarly, the dummy projections are not electrically connected to any other component. to be.
    Moreover, you may provide the wiring (not shown) which is not connected anywhere other than a processus | protrusion.
    This is called dummy wiring.
    By providing a plurality of such bypass wirings, dummy protrusions, and dummy wirings, analysis of functions becomes more difficult.
    In other words, an IC chip module having a high confidentiality effect can be realized.
    In addition, by mounting such an IC chip module 74, an IC card having a high confidentiality effect can be realized.
    In this embodiment, the thicknesses of the surface layer materials 32 and 36 are all 0.1 mm, and the thickness of the entire IC card 70 is 0.786 mm.
    The IC chips 76 and 78 each have a square of 3 mm on one side, and the thickness inside the main body is 0.2 mm, and the thicknesses of the projections 82 and 84 are both 0.02 mm.
    The thickness of the anisotropic conductor 80 is 0.11 mm.
    The thickness of the IC chip module 74 after the coupling is about 0.55 mm.
    However, the present invention is not limited to these dimensions and materials.
    The operation of the IC card 70 is the same as that of the conventional IC card 2.
    That is, the electromagnetic wave transmitted from the reader / writer (recording / reading device, not shown) is received by a resonant circuit (not shown) constituted by the coil 44 and the condenser C1 built in the IC chip 78. Let this be the power source.
    The obtained electric power is smoothed by the capacitor C2.
    In addition, a control unit (not shown) provided in the IC chip 76 decodes the information transmitted by overlapping the electromagnetic wave and responds.
    The response is made by changing the impedance of the resonant circuit.
    The reader / writer can know the response contents by detecting a change in the impedance of the resonant circuit (not shown) of the self accompanying the change in the impedance of the resonant circuit of the IC card 77.
    In this way, information can be transmitted and received without contact with the power supply.
    In addition, in the above-described embodiment, the IC chip 76 and the IC chip 78 are laminated and bonded through the anisotropic conductor 80, but the IC chip 76 and the IC chip 78 are bonded to each other. It can also be combined directly stacked without going through.
    In this case, for example, one of the protrusions 82 and 84 may be formed by gold (Au), and the other may be formed by tin (Su), so as to be bonded using a co-crystal.
    In this configuration, the two IC chips 76 and 78 can be easily modularized using a conventional technique of coupling between terminals.
    In the above-described embodiment, at least one of the capacitors C1 and C2 is constituted by a ferroelectric, but all the capacitors may be ordinary dielectric capacitors.
    In addition, although the antenna built in the IC chip 78 was made into the coil 44 formed in the metal wiring layer 6, an antenna is not limited to such a form.
    Moreover, although the coil 44, the capacitor | condenser C1, and C2 were formed in the IC chip 78 together, you may make it the structure which forms a coil and a capacitor in another IC chip.
    Next, Fig. 7 shows a cross-sectional structure of a non-contact type IC card 30 as a circuit chip mounting card in another embodiment of the present invention.
    The appearance of the IC card 30 is almost the same as that of the IC card 70.
    In addition, the IC chip module 74 itself is almost the same as that of the IC card 70.
    Therefore, the operation of the IC card is almost the same as that of the IC card 70.
    As shown in FIG. 7, the IC card 30 has the structure which laminated | stacked the surface layer material 32 which is a 1st base material, the core member 34, and the surface layer material 36 which is a 2nd base material in this order.
    As the surface materials 32 and 36, synthetic resins such as vinyl chloride and PET (polyethylene terephthalate) are used.
    The core member 34 is made of synthetic resin.
    The ceramic frame 38 is embedded in the layer formed of the core member 34.
    The ceramic frame 38 is made of ceramic and is formed in a cylindrical shape.
    The ceramic frame 38 corresponds to the frame of the reinforcement body.
    As a result, in this embodiment, the reinforcement is composed only of the frame.
    The interior 38a of the ceramic frame 38 is a cavity.
    At the lower end of the interior 38a of the ceramic frame 38, an elastic material 40 serving as a cushioning member is provided in contact with the surface layer material 32.
    Adhesive silicone rubber is used as the elastic member 40.
    The IC chip module 74 as a circuit chip module is supported on the elastic member 40.
    Thus, the rigidity can be obtained by forming the reinforcement into a ceramic.
    Therefore, by embedding the ceramic frame 38 in the layer formed of the core member 34, the flexural rigidity, the torsional rigidity and the compressive rigidity of the IC card in the vicinity of the ceramic frame 38 can be extremely increased.
    For this reason, even if strong bending force, torsional force, pressure, or the like is applied to the IC card 30, the IC chip module 74 disposed in the interior 38a of the ceramic frame 38 does not significantly deform.
    Therefore, the IC chip module 74 is hardly damaged even when bending force, warping force, pressure, or the like is applied.
    That is, the reliability of the IC card 30 can be improved.
    In addition, even if an impact is applied to the IC card 30 by fixing the IC chip module 74 via the elastic member 40, the impact is not transmitted directly to the IC chip module 74.
    For this reason, breakage of the IC chip module 74 by an impact can be reduced.
    In the present embodiment, the thicknesses of the surface layer materials 32 and 36 are all 0.1 mm, and the thickness of the entire IC card is 0.786 mm.
    In addition, the IC chip module 74 has a square of 3 mm on one side.
    However, unlike the embodiment described above, the thickness of the IC chip module 74 is set to about 0.4 mm.
    The thickness of the resilient material 40 is 0.118 mm.
    The height of the ceramic frame 38 is 0.568 mm.
    The inner diameter of the ceramic frame 38 is set such that the gap with the built-in IC chip module 74 is about 0.2 to 0.3 mm.
    The outer diameter of the ceramic frame 38 is about 23 mm.
    However, the present invention is not limited to these dimensions and materials.
    In this embodiment, the IC chip module 74 is fixed to the surface material 32 via the elastic member 40 as shown in FIG. 7, but the IC chip is not passed through the elastic member 40. The module 74 may be configured to be directly fixed to the surface material 32.
    Next, Fig. 8 shows a cross-sectional structure of a non-contact type IC card 50 as a circuit chip mounting card in still another embodiment of the present invention.
    The appearance of the IC card 50 is the same as that of the IC card 30.
    However, as shown in FIG. 8, in the IC card 50, the shape of the ceramic frame 52 is different from that of the ceramic frame 38 in the IC card 30. As shown in FIG.
    As a result, the ceramic frame 52 is composed of only a cylindrical frame in that the ceramic frame 52 has a cylindrical portion 52a which is a frame and a bottom portion 52b which is a plate-like body which is continuously provided integrally at the lower end of the cylindrical portion 52a. Different from the ceramic frame 38.
    As shown in Fig. 8, the IC chip module 74 is directly fixed to the bottom portion 52b of the concave space 52c formed of the cylindrical portion 52a and the bottom portion 52b of the ceramic frame 52. Consists of.
    In this manner, the bottom portion 52b is continuously formed integrally at the lower end of the cylindrical portion 52a, whereby the rigidity of the ceramic frame 52 can be further increased.
    For this reason, desired rigidity can be ensured even if the dimension of the surface direction (X direction and Y direction in FIG. 1) of the ceramic frame 52 is enlarged to some extent.
    Therefore, the size of the IC chip module 74 can be increased.
    As a result, the size of the coil 44 embedded in the IC chip module 74 can be made larger.
    8, the frame module 54 is comprised as the ceramic frame 52 and the IC chip module 74 fixed to the ceramic frame 52. As shown in FIG.
    In this way, workability at the time of manufacture is improved and manufacturing cost is reduced.
    In this embodiment, the IC chip module 74 is configured to be directly fixed to the bottom portion 52b of the ceramic frame 52, but the bottom portion 52b of the IC chip module 74 and the ceramic frame 52 is fixed. It can also be comprised so that the elastic material 40 like shown in FIG.
    This configuration can mitigate the impact on the card.
    Next, Fig. 9 shows a cross-sectional structure of a non-contact type IC card 170 as a circuit chip mounting card in another embodiment of the present invention.
    The appearance configuration of the IC card 170 is the same as that of the IC card 30.
    9, however, in the IC card 170, the shape of the ceramic frame 172 which is a frame is different from that of the ceramic frame 38 in the IC card 30. As shown in FIG.
    As a result, the ceramic frame 172 is formed in a single cylindrical shape similarly to the outer ceramic frame 38, but the inner frame is different from the ceramic frame 38 in that it is formed in a cylindrical shape with a step.
    9, the support film 174 which is a shock absorbing member is adhere | attached to the step part 172a of the ceramic frame 172. As shown in FIG.
    The support film 174 is a film of synthetic resin formed into a hollow cone plate.
    Therefore, the supporting film 174 is supported by the stepped portion 172a of the ceramic frame 172 in the internal space 172b of the ceramic frame 172 and is in a hanging state.
    The IC chip module 74 is adhered to substantially the center of the support film 174.
    Therefore, the IC chip module 74 is supported by the supporting film 174 in the interior space 172b of the ceramic frame 172 and is suspended.
    In this way, the shock applied to the card can be more reliably alleviated.
    9, the frame module 176 is comprised by the ceramic frame 172, the support film 174, and the IC chip module 74. As shown in FIG.
    In this way, workability at the time of manufacture is improved and manufacturing cost is reduced.
    In this embodiment, a hollow plastic sheet-like synthetic resin film was used as the buffer member, but the shape and material of the buffer member are not limited thereto.
    In addition, although the cylindrical cylinder with a penetrating cylindrical shape or a bottom face was used as a reinforcement body in the above-mentioned embodiment, the shape of the outer side and the inner side of a cylinder are not limited to such a cylindrical shape.
    For example, quadrangular ordinary ones may be used as the reinforcing bodies.
    In addition, a reinforcement is not limited to a normal thing, For example, a flat thing can also be used.
    In addition, a plurality of reinforcing bodies may be provided.
    For example, a reinforcement may be provided above and below the circuit chip to sandwich the circuit chip.
    In the above-described embodiment, the reinforcing body is made of ceramic, but any material other than ceramic may be used as long as the material is large in rigidity.
    For example, metal materials, such as stainless steel, hard synthetic resin etc. can be used.
    Next, an IC chip module as a circuit chip module in still another embodiment of the present invention will be described.
    This IC chip module is almost the same structure as the IC chip module 74 shown in FIG.
    However, while the resonant circuit of the IC chip module 74 shown in FIG. 3 is a circuit having the same shape as the resonant circuit 22 shown in FIG. 13B, the resonant circuit of the IC chip constituting the IC chip module in the present embodiment is used. The furnace is different in that it is a resonant circuit 150 shown in FIG.
    The resonant circuit 150 is constituted by a capacitor L 152 and a coil L having five capacitors C1 to C5 and five laser taps T1 to T5. It is connected as shown in FIG.
    In the capacitor | condenser part 152, capacitor | condenser C1-C5 are connected in parallel via the laser tap T1-T5, respectively.
    The laser tabs T1 to T5 are conductive tabs and can be cut by irradiating a laser.
    The synthetic capacitance of the condenser portion 152 can be adjusted by cutting the appropriate tab among the laser taps T1 to T5.
    The resonance frequency of the resonant circuit 150 can be adjusted by adjusting the combined capacitance of the condenser unit 152.
    The laser tabs T1 to T5 are cut in the step after forming the capacitors C1 to C5, the coil L, and the like on the IC chip.
    For example, the resonant frequency can be measured while sequentially cutting the laser tabs T1 to T5 so that the cutting can be terminated when the resonant frequency reaches a predetermined threshold value.
    In the case where there is little unevenness between IC chips manufactured in the same process, the optimum pattern is found using the IC chip for testing. Then, for the IC chip manufactured in the same process, the laser tabs T1 to ( T5) may be cut.
    When there are a plurality of types of IC chips, different resonant frequencies can be set for each type of IC chip by changing the cutting patterns of the laser taps T1 to T5 for each type of IC chip.
    The capacities of the capacitors C1 to C5 may all be the same, or may have different configurations.
    For example, the capacitances of the capacitors C1 to C5 may be set to 1 kV, 2 kV, 4 kV, 8 kV, and 16 kV, respectively.
    In this way, the combined capacitance can be adjusted at intervals of 1 ms between 1 ms and 31 degrees.
    The number of capacitors and laser tabs is not limited to five.
    Instead of the resonance circuit 150 shown in FIG. 10, the resonance circuit 160 shown in FIG. 11 may be used.
    The resonant circuit 160 is composed of a coil portion 162 and a capacitor C having six coils L1 to L6 and five laser tabs T1 to T5. It is connected as shown.
    In the coil section 162, the coils L1 to L6 are connected in series, and the connection points of the respective coils are short-circuited via the laser tabs T1 to T5.
    By cutting the laser tabs T1 to T5 in this order, the combined inductance of the coil portion 162 can be adjusted.
    The resonance frequency of the resonant circuit 160 can be adjusted by adjusting the combined inductance of the coil unit 162.
    The number of coils and laser tabs is not limited to five.
    Moreover, the resonant circuit which can adjust resonant frequency is not limited to these.
    For example, the resonance circuit 150 may be combined with the resonance circuit 150 of FIG. 10 and the resonance circuit 160 of FIG.
    In this way, the resonant frequency of the resonant circuit can be adjusted so that the capacitor or coil can be formed of an IC chip, and then the capacitance or inductance of the resonant circuit can be adjusted.
    Therefore, although all the circuit elements constituting the resonant circuit are formed in the IC chip, the resonance frequency can be adjusted after the formation of these circuit elements.
    In other words, even if there are variations in the manufacturing conditions, the resonance frequency can be made constant to some extent, so that the reliability of the IC card equipped with such an IC chip is high.
    In the IC chip manufacturing process, the IC chip corresponding to various resonance frequencies can be obtained without changing the mask pattern for forming the circuit element, so that the manufacturing cost can be kept low.
    In addition, although each coil mentioned above used the coil formed in the loop form as an antenna, the form of an antenna is not limited to these.
    As the antenna, for example, straight metal wires, meandering metal wires, or the like can be used.
    In each of the embodiments described above, an example in which the present invention is applied to a one-coil non-contact type IC card has been described, but the present invention can also be applied to a so-called multiple coil type non-contact type IC card.
    In addition to the non-contact type IC card, the present invention can also be applied to a contact type IC card.
    In addition, the present invention can be applied not only to an IC card but also to an entire module and a whole card in which a circuit chip is mounted.
    The card mentioned here is a board member substantially, and a credit card, the commuter pass of a railroad, the ticket of a railroad, etc. are applicable.
    According to the circuit chip module of the present invention, two circuit chips can be combined to perform an original function for the first time.
    Therefore, even if the circuit chip module is decomposed into two circuit chips, it is difficult to analyze the function from each terminal.
    In addition, by providing a plurality of bypass wirings, analysis of the function becomes further difficult.
    That is, a circuit chip module with a high secret protection effect can be realized.
    权利要求:
    Claims (17)
    [1" claim-type="Currently amended] A card having an antenna that communicates using electromagnetic waves and a processor that performs a process related to communication,
    A first circuit chip comprising at least a portion of the processing portion and having a terminal;
    And a second circuit chip having a terminal while including an antenna and a remainder of the processing portion,
    And the first circuit chip and the second circuit chip are laminated in the thickness direction of the card, so that the terminals are electrically connected to each other.
    [2" claim-type="Currently amended] The method of claim 1,
    A terminal is provided on the second circuit chip side of the first circuit chip, and a terminal is provided on the first circuit chip side of the second circuit chip opposite the terminal provided on the first circuit chip. And combining the first circuit chip and the second circuit chip by directly stacking the circuit chip mounted card.
    [3" claim-type="Currently amended] The method of claim 1,
    The terminal is provided on the second circuit chip side of the first circuit chip, and the terminal is opposite to the terminal provided on the first circuit chip on the first circuit chip side of the second circuit chip. And the first circuit chip and the second circuit chip are laminated by laminating through an anisotropic conductor.
    [4" claim-type="Currently amended] The method of claim 1,
    And the second circuit chip comprises a condenser and a coil constituting the antenna.
    [5" claim-type="Currently amended] The method of claim 4, wherein
    And a resonant circuit formed by at least one capacitor and a coil of the circuit elements constituting the second circuit chip.
    [6" claim-type="Currently amended] The method of claim 4, wherein
    The coil is a circuit chip mounting card, characterized in that the metal wiring layer is formed in a loop shape.
    [7" claim-type="Currently amended] The method according to any one of claims 4 to 6,
    A circuit chip mounting card, characterized in that at least one of the capacitors is formed of a ferroelectric material.
    [8" claim-type="Currently amended] The method according to any one of claims 1 to 3,
    And the circuit chip comprises a nonvolatile memory and a modulation / demodulation circuit constituting a processing unit.
    [9" claim-type="Currently amended] A card having an antenna that communicates using electromagnetic waves and a processor that performs a process related to communication,
    The first description,
    A second substrate disposed at a predetermined distance in the thickness direction of the card with respect to the first substrate;
    A core member layer disposed between the first substrate and the second substrate,
    A circuit chip module disposed in the core member layer,
    The circuit chip module includes a first circuit chip including at least a part of the processing unit and having a terminal, and a second circuit chip including an antenna and a remaining part of the processing unit and a terminal provided opposite the terminal. And an assembly in which the terminals are electrically connected to each other by being laminated and bonded in the thickness direction of the card via an anisotropic conductor.
    [10" claim-type="Currently amended] The method according to claim 1 or 9,
    And a reinforcement having a frame arranged to surround the first circuit chip and the second circuit chip in a plane direction that is a direction orthogonal to the thickness direction of the card.
    [11" claim-type="Currently amended] A circuit chip module constituting a card in which a circuit including an antenna for communicating with electromagnetic waves and a processing section for performing communication-related processing is provided.
    A first circuit chip comprising at least a portion of the processing portion and having a terminal;
    And a second circuit chip having a terminal while including an antenna and a remainder of the processing portion,
    And the first circuit chip and the second circuit chip are laminated in the thickness direction of the card so as to electrically connect the terminals with each other.
    [12" claim-type="Currently amended] The method of claim 11,
    And an anisotropic conductor interposed between the first circuit chip and the second circuit chip.
    [13" claim-type="Currently amended] The method of claim 11,
    And a resonant frequency of the resonant circuit constituted by the capacitors and the coils of the antennas provided in the first and second circuit chips.
    [14" claim-type="Currently amended] The method of claim 13,
    And cutting the wires of the plurality of capacitors pre-assembled in the first and second circuit chips selectively so as to obtain a desired resonance frequency.
    [15" claim-type="Currently amended] The method of claim 14,
    And cutting the wires of the plurality of coils pre-assembled in the first and second circuit chips to obtain a desired resonance frequency.
    [16" claim-type="Currently amended] A circuit chip assembly comprising a stack of a first circuit chip and a second circuit chip,
    A terminal is provided on the second circuit chip side of the first circuit chip, and a terminal is provided on the first circuit chip side of the second circuit chip,
    The first circuit chip and the second circuit chip are laminated, and the terminal provided on the first circuit chip and the terminal provided on the second circuit chip are electrically connected.
    A bypass wiring for electrically connecting two terminals of one circuit chip to at least one circuit chip of the first circuit chip and the second circuit chip, and the other connected to the two terminals, respectively. A circuit chip module configured to electrically connect two terminals of a circuit chip of the circuit chip via a bypass wiring.
    [17" claim-type="Currently amended] A circuit chip mounting card comprising a circuit chip module including a circuit chip assembly comprising a first circuit chip and a second circuit chip stacked thereon,
    The circuit chip module,
    A terminal is provided on the second circuit chip side of the first circuit chip, and a terminal is provided on the first circuit chip side of the second circuit chip,
    By stacking the first circuit chip and the second circuit chip, the terminal provided on the first circuit chip and the terminal provided on the second circuit chip are electrically connected to each other.
    On at least one circuit chip of the first circuit chip and the second circuit chip, a bypass wiring for electrically connecting two terminals of the one circuit chip is provided and connected to the two terminals, respectively. A circuit chip mounted card, characterized in that the two terminals of the other circuit chip are configured to be electrically connected through a bypass wiring.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-27|Priority to JP8-351377
    1996-12-27|Priority to JP35137784
    1997-12-22|Application filed by 사토 게니치로, 로무 가부시키가이샤
    2000-10-25|Publication of KR20000062336A
    优先权:
    申请号 | 申请日 | 专利标题
    JP8-351377|1996-12-27|
    JP35137784|1996-12-27|
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